s m d g e n e r a l p u r p o s e r e c t i f i e r s glass passivated t ype reverse v oltage: 200 to 1000 v olts forward current: 2.0 amp rohs device page 1 rev :a features - glass passivated cavity-free junction. - lead less chip form, no lead damage. - plastic package has underwriters lammability classification 94v -0. - low forward voltage drop. mechanical data - case: packed with frp substrate and epoxy underfilled. - polarity: cathode band, laser marking. - w eight: 0.04 grams (approx). cgrbt201-hf thru. cgrbt205-hf qw -jg005 no tes : th erm al r esi sta nce fro m jun ctio n t o a mb ien t a nd fro m jun ctio n t o le ad p .c. b. mo nut ed on 0. 2 0.2 (5 .0* 5.0 mm ) c opp er pad ar eas . comchip t echnology co., l td. absolute maximum ratings (at t a=25c unless otherwise noted) cgrbt 201-hf repetitive peak reverse voltage peak forward surge current, 8.3ms single half sine-wave superimposed on rate load (jedec method) a verage forward current operating junction temperature storage temperature cgrbt 202-hf cgrbt 203-hf cgrbt 204-hf cgrbt 205-hf units symbol parameter v rrm i fsm i f(a v) t j t stg 200 400 50 2.0 -65 to +175 -65 to +175 600 v a a c c 800 1000 company reserves the right to improve product design , functions and reliability without notice. repetitive peak reverse current v ua parameter conditions forward voltage thermal resistance v r =max. v rrm, t a =25c junction to ambient (note) symbol i rrm r ja c j min. typ . max. 5 66 unit i f =2.0a 0.96 1 0.10 junction capacitance v r =4v , f=1.0mh z 14 pf junction to lead (note) r jl 8 c/w - -- - -- - -- v f - -- - -- - -- - -- - -- electrical characteristics (at t a=25c unless otherwise noted) halogen free d i m e n s i o n s i n i n c h e s a n d ( m i l l i m e t e r ) 0 . 2 0 9 ( 5 . 3 0 ) 0 . 2 0 1 ( 5 . 1 0 ) 0 . 1 4 6 ( 3 . 7 0 ) 0 . 1 3 8 ( 3 . 5 0 ) 0 . 0 4 9 ( 1 . 2 5 ) 0 . 0 4 1 ( 1 . 0 5 ) 0 . 0 4 9 ( 1 . 2 5 ) 0 . 0 4 1 ( 1 . 0 5 ) 0 . 0 4 1 ( 1 . 0 5 ) 0 . 0 5 3 ( 1 . 3 5 ) r 0 . 0 2 8 ( 0 . 7 1 ) 2 1 1 4 / d o - 2 1 4 a a r 0 . 0 2 7 ( 0 . 6 8 ) 0 . 11 9 ( 3 . 0 1 ) t y p . c i r c u i t d i a g r a m - t erminals: pure t in plated (lead-free), solderable per mil-std-750, method 2026.
qw -jg005 ra ting and characteristic cur ves (cgrbt201-hf thru. cgrbt205-hf) comchip t echnology co., l td. page 2 rev :a s m d g e n e r a l p u r p o s e r e c t i f i e r s company reserves the right to improve product design , functions and reliability without notice. fig .1 - for w ard current dera ting cur ve fig .3 - typical inst ant aneous for w ard characteristics a v e r a g e f o r w a r d r e c t i f i e d c u r r e n t , ( a ) 2.0 2.5 1.5 1.0 0.5 i i n s t a n t a n e o u s f o r w a r d c u r r e n t , ( a ) 0.10 1.00 10.00 0.01 0.2 0.4 0.6 0.8 1.0 1.2 1.4 0 0 25 50 75 100 125 150 175 lead tempera ture , ( c) inst ant aneous for w ard vol t age , ( v ) fig .2 - maximum non - repetitive peak for w ard surge current p e a k f o r w a r d s u r g e c u r r e n t , ( a ) number of cycles a t 60 hz 8.3 ms single half sine - w a ve 0 10 30 50 60 40 1 10 100 percent of ra ted peak reverse vol t age , (%) fig .4 - typical reverse characteristics i n s t a n t a n e o u s r e v e r s e l e a k a g e c u r r e n t , ( u a ) 0.01 0.001 0 20 0.10 1.0 10 100 40 60 80 100 fig .5 - typical junction cap acit ance reverse vol t age , (v) 0.1 j u n c t i o n c a p a c i t a n c e , ( p f ) 200 1.0 10 100 10 100 1 t j =25 c t j =25 c t j =125 c t j =150 c resistive or inductive load 60hz 20
s m d g e n e r a l p u r p o s e r e c t i f i e r s b c d d d 2 d 1 e f p p 0 p 1 s y m b o l w w 1 ( m m ) ( i n c h ) 0 . 1 5 6 0 . 0 0 4 0 . 2 1 9 0 . 0 0 4 0 . 0 5 7 0 . 0 0 4 0 . 0 5 9 0 . 0 0 4 1 2 . 9 9 2 0 . 0 7 9 1 . 9 6 9 m i n . 0 . 5 1 2 0 . 0 2 0 s y m b o l ( m m ) ( i n c h ) 0 . 0 6 9 0 . 0 0 4 0 . 2 1 7 0 . 0 0 2 0 . 3 1 5 0 . 0 0 4 0 . 1 5 7 0 . 0 0 4 0 . 0 7 9 0 . 0 0 4 0 . 4 7 2 0 . 0 1 2 0 . 5 6 7 m a x . 3 . 9 5 0 . 1 0 5 . 5 5 0 . 1 0 8 . 0 0 0 . 1 0 1 . 5 0 0 . 1 0 5 . 5 0 0 . 0 5 1 . 7 5 0 . 1 0 5 0 . 0 m i n . 1 3 . 0 0 . 5 0 1 . 4 5 0 . 1 0 4 . 0 0 0 . 1 0 2 . 0 0 0 . 1 0 1 2 . 0 0 0 . 3 0 1 4 . 4 m a x . 3 3 0 2 . 0 0 reel t aping specification o 1 2 0 t railer device leader 10 pitches (min) 10 pitches (min) ....... ....... ....... ....... ....... ....... ....... ....... end start d 1 d w 1 t c direction of feed i n d e x h o l e d e f b w p p 0 p 1 a a d 2 page 3 qw -jg005 rev :a comchip t echnology co., l td. company reserves the right to improve product design , functions and reliability without notice. ( d o - 2 1 4 a a ) 2 1 1 4 ( d o - 2 1 4 a a ) 2 1 1 4
s m d g e n e r a l p u r p o s e r e c t i f i e r s page 4 qw -jg005 rev :a comchip t echnology co., l td. company reserves the right to improve product design , functions and reliability without notice. standard packaging c a s e t y p e 5 , 0 0 0 r e e l ( p c s ) reel size (inch) 1 3 r e e l p a c k 2 1 1 4 / d o - 2 1 4 a a suggested p ad layout a b size (inch) 0.1 18min. (mm) 3.00min. 2.65max. 6.65ref . 0.104max. 0. 26 2 re f . 21 14/do-214aa a b c c marking code 20d part number marking code cgrbt201-hf cgrbt202-hf cgrbt203-hf 20g 20j CGRBT204-HF 20k cgrbt205-hf 20m bgc .xxx. xxx = product type marking code
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